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Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Category | Interface - Telecom | |
Manufacturer | Analog Devices Inc./Maxim Integrated | |
RoHS | 1 | |
Interface | TDMoP | |
Function | TDM-over-Packet (TDMoP) | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Supplier Device Package | 676-TEPBGA (27x27) | |
Base Product Number | DS34S132 | |
Series | - | |
Voltage - Supply | 1.8V, 3.3V | |
Current - Supply | - | |
Package / Case | 676-BGA | |
Number of Circuits | 1 |
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