Korean memory giant Samsung has announced the commencement of mass production of the world's thinnest 12nm LPDDR5X DRAM packages, reinforcing its leadership in the low-power DRAM market. These packages feature a four-layer stack with each stack consisting of two layers and are available in 12GB and 16GB capacities.
Samsung stated that by leveraging its chip packaging expertise, it offers ultra-thin LPDDR5X DRAM packages that provide more space for mobile devices and improve thermal performance. This supports simpler thermal management, which is becoming increasingly important for high-performance computing applications such as data center AI servers.
Samsung optimizes printed circuit boards (PCB) and epoxy molding compounds (EMC) and employs wafer back grinding to minimize package height. The LPDDR5X DRAM memory package is as thin as a fingernail, with a height of only 0.65mm, making it the thinnest memory package module with more than 12GB in its class. It reduces thickness by approximately 9% compared to the previous generation and enhances heat resistance by about 21.2%.
Samsung plans to expand the low-power DRAM market with its new 0.65mm LPDDR5X DRAM, meeting the growing demand for smaller, high-performance, and high-density mobile memory solutions. Samsung is also working on developing six-layer stacked 24GB and eight-layer stacked 32GB modules, offering the thinnest LPDDR DRAM packages.
