CES 2025 is in full swing, with AI once again dominating the spotlight. Major semiconductor players like Qualcomm, MediaTek, NVIDIA, Intel, AMD, SK hynix, and Black Sesame Technologies have showcased cutting-edge innovations, including SoCs, CPUs, GPUs, and memory solutions. These advancements, closely aligned with AI trends, are delivering significant performance upgrades and capturing widespread attention.
Qualcomm: Introducing Snapdragon X AI Chip
Qualcomm unveiled its latest AI-focused processor, Snapdragon X, built on a 4nm process. The chip features 8 Oryon CPU cores clocked up to 3GHz, delivering robust computing power for next-gen PCs. Major tech giants, including Acer, ASUS, Dell, and Lenovo, have committed to integrating Snapdragon X into their AI PCs, with releases expected later this year.
Qualcomm's CEO Cristiano Amon highlighted the company's commitment to edge AI, emphasizing how AI processing is increasingly shifting to the edge to enable seamless and transformative user experiences.
MediaTek and NVIDIA: Launching the GB10 Super Chip
In a strategic collaboration, MediaTek and NVIDIA revealed the GB10 Grace Blackwell Super Chip at CES 2025. Designed for NVIDIA’s Project DIGITS, a personal AI supercomputer, the chip aims to bring enterprise-level AI capabilities to individual users. This marks a significant milestone in democratizing high-performance computing for researchers and developers.
NVIDIA: Debuting GeForce RTX 50 Series GPUs
NVIDIA stole the spotlight with the announcement of its GeForce RTX 50 Series, powered by the Blackwell architecture. The GPUs feature 920 billion transistors, 4 PFLOPS of AI compute power, and enhanced ray tracing capabilities. Key innovations include neural texture compression and neural material shading, elevating gaming and graphics processing to new heights.
Intel: Showcasing Intel 18A Process Node
Intel unveiled its first 18A node chip, set to power the Panther Lake processor scheduled for release in late 2025. With 16 cores and a focus on high efficiency, Panther Lake aims to redefine performance for enterprise users and gamers alike.
Intel also announced advancements in its Core Ultra 200V series processors, designed to deliver unparalleled performance for AI-intensive workloads.
AMD: Expanding AI PC Solutions
AMD presented its Ryzen AI Max series, featuring up to 16 Zen 5 CPU cores and 50 TOPS of AI performance via AMD XDNA2 NPU technology. Targeting high-end laptops and AI-driven workloads, AMD continues to push boundaries with its innovative processor lineup.
SK hynix: Cutting-Edge AI Storage Solutions
At CES 2025, SK hynix introduced its latest memory innovations, including 16-layer HBM3E, DDR5 RDIMM, and MCR DIMM modules. These technologies are tailored for AI-driven data centers, offering unmatched capacity and speed for large-scale processing demands.
Black Sesame Technologies: Launching HuaShan A2000
Among the few Chinese semiconductor firms at CES, Black Sesame Technologies unveiled its HuaShan A2000 chip, designed for high-performance AI and autonomous driving. Built on a 7nm process, the A2000 integrates Black Sesame’s JiuShao NPU core, providing robust support for advanced AI scenarios.
Conclusion
CES 2025 highlights the accelerated convergence of AI and semiconductor technologies, with significant progress in servers, data centers, AI PCs, and autonomous systems. As AI continues to drive innovation, the competition among semiconductor giants is poised to intensify, shaping the future of technology.
