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Our focus stays in using the fastest and the most cost efficient solution to help customers to solve production shortage, and to achieve the great creation from design to finished product.
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Decades of sourcing quality electronic components have earned NOVA a reputation as the world’s leading independent distributor.

News and events Learn about our latest news

NVIDIA Unveils Silicon Photonics Network Switches with TSMC COUPE Packaging Technology

March 14, 2025 – At GTC 2025, NVIDIA introduced its Spectrum-X Photonics and Quantum-X Photonics network switch platforms, leveraging silicon photonics technology to dramatically enhance data transmission speeds and efficiency. These new AI-driven networking solutions aim to support large-scale GPU clusters with unprecedented bandwidth and reliability, reinforcing NVIDIA’s leadership in AI infrastructure and high-performance computing (HPC).

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Broadcom Secures Google’s Seventh-Generation TPU Orders Amid MediaTek Partnership

March 14, 2025 – Despite reports that Google is collaborating with MediaTek on its next-generation Tensor Processing Units (TPUs), Broadcom remains a key supplier, securing orders for Google’s upcoming TPU v7 series, which is expected to launch in 2026.

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March 14, 2025 – Synopsys has announced the launch of its next-generation HAPS-200 prototyping and ZeBu-200 emulation systems, leveraging AMD’s latest Versal Premium VP1902 system-on-chip (SoC). These new solutions enhance hardware-assisted verification (HAV) capabilities, delivering unmatched performance, faster debugging, and optimized compilation times.

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On March 18, 2025, NVIDIA CEO Jensen Huang took the stage at GTC 2025, unveiling the company’s latest AI powerhouse, Blackwell Ultra, while also offering a glimpse into the future with Rubin, NVIDIA’s next-generation AI chip architecture.

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March 19, 2025 – SK Hynix has officially announced the world’s first 12-layer HBM4 sample, marking a major milestone in AI-driven high-performance memory development. The company has begun early sample shipments to key customers and expects to start mass production in the second half of 2025.

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A collaborative research team from École Polytechnique Fédérale de Lausanne (EPFL) and IBM Research Europe has unveiled a new photonic chip-based traveling wave parametric amplifier, significantly expanding optical signal bandwidth. The findings, published in Nature, mark a major step toward enhancing data transmission efficiency.

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